Product Introduction
The wafer thinning machine is a critical tool in semiconductor fabrication, designed to reduce wafer thickness through precise back grinding and polishing. This wafer thinning machine ensures high uniformity and surface quality, making it suitable for materials such as silicon, GaAs, GaN, and SiC. It plays an essential role in applications like power devices, MEMS, and CMOS image sensors.
Working Principle
The wafer thinning machine operates by securing the wafer and engaging it with a high-speed rotating grinding wheel. This wafer thinning machine incorporates advanced control systems to monitor grinding pressure and thickness in real time, ensuring stable and reliable thinning. Integrated cooling and cleaning mechanisms improve processing yield and minimize damage.
Wafer Thinning Machine Specification
| Parameter | Specification | Remarks |
| Wafer Size | Ø2" to Ø12" (Optional: Ø8" and above) | Supports up to 300mm |
| Thinning Range | 50μm - 800μm | Minimum possible thickness: 20μm (depends on material) |
| Thickness Accuracy | ±1μm | With optional in-line thickness measurement |
| Surface Roughness | <5nm Ra (after fine grinding) | Depends on material and wheel type |
| Grinding Wheel Type | Diamond Cup Wheel | Replaceable |
| Spindle Speed | 500 - 6000 rpm | Stepless speed control |
| Vacuum Chuck | Supported | Porous ceramic vacuum chuck |
| Cooling System | Water + Air Cooling | Prevents thermal damage |
| Operation Mode | Touchscreen with PLC Control | Parameters adjustable and programmable |
| Optional Features | Auto loading/unloading, thickness monitor, CCD alignment | Customizable |
| Power Supply | AC 380V ±10%, 50/60Hz, 3-phase | Custom voltage options available |
| Machine Dimensions | Approx. 1800mm × 1500mm × 1800mm | May vary slightly by model |
| Weight | Approx. 1500 kg | Without auto-handling system
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Applications
The wafer thinning machine is widely used in various semiconductor manufacturing processes where ultra-thin wafers are required, such as 3D IC packaging, power device fabrication, image sensors, and RF chips. The wafer thinning machine is often paired with post-thinning processes like backside metallization to provide a complete thinning solution.
In addition, the wafer thinning machine is applicable in the following scenarios:
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Advanced Packaging: Including FO-WLP, 2.5D, and 3D packaging, where thinner wafers enable higher integration and shorter interconnects.
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MEMS Device Fabrication: Wafer thinning improves sensor sensitivity by releasing the structural layer.
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Power Semiconductor Devices: Materials like SiC and GaN require wafer thinning to reduce conduction loss and improve heat dissipation.
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LiDAR Chips: Wafer thinning supports better optical alignment and electrical performance.
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R&D and Academia: Universities and research institutions use the wafer thinning machine to explore semiconductor structures and verify new materials.
Q&A
Q1:What materials can be processed by this wafer thinning machine?
A1:Our wafer thinning machine is compatible with a wide range of materials, including silicon (Si), silicon carbide (SiC), gallium nitride (GaN), sapphire, gallium arsenide (GaAs), and more.
Q2: How does this wafer thinning machine ensure uniform thickness?
A2: It uses a precision grinding head with real-time thickness monitoring and adaptive control systems to maintain consistent thinning results.
Q3: What is the thickness range of this wafer thinning machine?
A3: Wafers can be thinned to 50μm or even thinner, depending on the material and application requirements.
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